News
21
2025.03
Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK
Nexperia introduces a range of highly efficient and robust industrial grade 1200 V silicon carbide (SiC) MOSFETs with industry leading temperature stability in innovative surface-mount (SMD) top-side cooled packaging technology called X.PAK
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07
2025.01
ECIA： The enthusiasm for electronic component sales has increased in January 2025
The enthusiasm for electronic component sales has increased in January 2025
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19
2024.02
Top 5 Robotics Trends of 2024
The latest IFR report shows that the global inventory of operational robots has reached a new record of approximately 3.9 million units. This demand is driven by a series of exciting technological innovations.
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23
2024.01
Global PCB production value will return to positive growth, and PCB manufacturers are expected to achieve good performance
Driven by the demand for advanced packaging, autonomous driving, new energy, and AI applications, the global PCB output value is expected to return to a positive growth range in 2024.
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